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Italy
10129 Torino
Corso Castelfidardo 30/a
Tel. +39.0110903334
Our company designs circuits for a variety of devices:
High reliability electronic products
Our circuit design considers the following operating conditions of a device:
- wide temperature range (from -60°С to +125°С);
- increased loads;
- high loads strong electromagnetic influences;
- unstable power supply.
The devices are robust reliable, fail safe, and long-lasting.
Products for Industrial Purposes
Our circuit design considers the following operating conditions of a device:
- industrial temperature range (from -40°С to +85°С);
- broad range of input voltage;
- electromagnetic interference;
- periodic loads;
- harsh environmental conditions.
The devices are used in industrial automation, automotive electronics and special tool engineering.
Devices of general and commercial use
Circuit development is based on generic principles and the Customer’s technical specifications.
Our engineers are highly skilled in:
- developing electronic devices based on FPGA, ASICs, microcontrollers and microprocessors;
- designing DDR and high-speed interfaces (PCIe, SATA, Gigabit Ethernet etc.).
Circuit documentation meets the industrial Standards. For device development we use widely available components.
We offer design and routing of PCB of any complexity. We can design a PCB from scratch, or a Customer's underway project, or a circuit that we have already designed for the Customer in the previous work stage.
Our PCB designers pay a particular attention to the following:
- obtaining the PCB-outline dimentions from the Customer;
- definition of the PCB class;
- selection of materials, in the view of further manufacturing;
- PCB assembly type: automatic, selective, manual;
- number of layers and PCB stack-up, considering the necessary values of the trace impedances;
- application of precise 3D models of components in order to construct a full 3D model of the PCB and use it for enclosure testing;
- pre-routing analysis of the digital and complex analog nets;
- meeting high-speed interfaces requirements;
- design according to IPC standards (IPC-2221, IPC-7351) and manufacturers’ recommendations;
- post-routing analysis of the power nets, high-speed interfaces, and analog signals;
- maximum test coverage via additional technological elements for JTAG (IEEE 1149), peripheral scanning, and external measurement equipment;
- preparation for PCB production;
- panelization;
- uploading Gerber and drilling files;
- issuing documentation for assembly;
- support in the production stage and in the spare part selection.
All documentation meets the industry standards. Our company works in cooperation with local and international PCB manufacturers and component suppliers.
Our designers work on projects of any level of complexity.
They design:
- device structure;
- enclosures, boxes, and cases;
- assembly components.
Our work experience helps us to successfully develop the following boxes and cases:
- hermetic aluminum enclosures for severe operating conditions;
- light-sheet metal boxes for general use;
- rework of standard commercially available;
- plastic molding;
- customized solutions, for exhibitions or experiments.
When developing boxes and cases, we consider:
- durability;
- thermal control;
- screening with additional passive methods for EMC provision;
- convenient assembly, servicing, and cable lining of the device;
- cost efficiency;
- weight and size minimization;
- meeting the cutting-edge requirements of ergonomy and design.
Cases are designed in mechanical CAD systems with a mandatory arrangement of the PCBs inside. Development meets the manufacturer’s production requirements.
Experienced engineers know that a successful development mostly depends on the power quality.
Analysis of power distribution and electromagnetic radiation, created by the electronic module, helps to significantly improve the stability of high-speed interfaces and eases the adjustment of a device under extreme conditions.
We offer:
- currents calculation (current density and voltage drop) considering the heat conditions of an electronic module;
- impedance calculation of power nets and identification of resonance frequencies;
- optimization of a matrix of filtering condensers;
- minimization of electromagnetic radiation at operating frequencies.
Electromagnetic compatibility tests are becoming predictable!
Modern high-speed interfaces are extremely sensitive to the quality of the signal nets routing. Following all the manufacturer’s recommendations might be difficult or, at times, simply impossible.
Searching for an optimal solution is a time-consuming procedure, which the time-frame of a project does not normally allow for. Therefore, one of the hardest tasks is to ensure within the shortest time that the interface works at maximum speed.
Our company specializes in simulation of high-speed interfaces (DDR, PCI, PCIe, USB, HDMI, SFP+, etc.).
We provide:
- extraction of s-parameters of single and differential signal lines (evaluation of insertion loss and return loss, crosstalk);
- modeling of high-speed interfaces, considering inconsistent power supply conditions;
- eye diagramm estimation, selection of the best tuning options for the transmitter and the receiver.
It is a challenging task to ensure a device functionality in the wide temperature range. At -60°C, the device has to quickly boot up; at +125 °C it has to be cooled to avoid localized overheating.
We offer you cooling (and heating) verification services to support your design engineers during the design phase.
In our thermal simulations of electronic devices, we take into account heating due to electric current.
We solve the problems related to:
- thermal conductivity in solid bodies;
- hydrodynamics (air or water cooling);
- analysis of the thermal condition of an electronic module taking into account heating due to electric current.
Italy
10129 Torino
Corso Castelfidardo 30/a
Tel. +39.0110903334